国际学术组织和国际会议任职 (Positions in International Academic Organizations and Meetings)


国际学术组织和国际顾问委员会:


1. 亚洲电子陶瓷学会(AECA)执委会主席
Executive Committee of Asian Electroceramics Association (AECA), Chair (2016-), memeber(2005-)

2. IEEE UFFC铁电委员会委员
Member of IEEE UFFC Ferroelectric Committee

 

3. IEEE TUFFC副编辑

Associate Editor of IEEE Transactions on Ultrasonica, Ferroelectrics and Frequency Control

 

4. IEEE高级会员
IEEE Senior Member

5. 国际电子陶瓷会议(ICE)国际顾问委员会(IAB)委员
Member of International Advisory Board of the International Conference on Electroceramics (ICE)

6. 微波材料与应用国际会议(MMA)国际顾问委员会(IAB)委员
Member of International Advisory Board of the International Conference on Microwave Materials and Their Applications (MMA)

 

 
国际会议主席和分会主席:

1. 第一届“新一代极性氧化物材料与器件” 中德研讨会主席，西安，中国，2005
Chair of the 1st Sino-German workshop on New Generation Polar Oxides and Devices, Xi’an, China, 2005.

2. 第十二届国际铁电学会议及第十八届铁电体应用国际研讨会联合会议（IMF-ISAF2009）程序主席，西安，中国，2009
Program Chair of the 12th International Meeting on Ferroelectrics & the 18th IEEE International Symposium on the Application of Ferroelectrics (IMF-ISAF2009), Xi’an, China, 2009.

3. 2011功能氧化物研讨会主席，西安，中国，2011
Chair of 2011 Workshop on Functional Oxides, Xi’an, China, 2011.
4. 第八届亚洲电子陶瓷会议（AMEC-8）程序主席，槟城，马来西亚，2012
Program Chair of the 8th Asian Meeting on Electroceramics (AMEC-8), Penang, Malaysia, July 2-5, 2012.
5.  Chair of Symposium 3: Electronic and Magnetic Ceramics in The 5th International Congress on Ceramics (ICC5), Beijing, China, August 17-21, 2014.

6. 第九届环太平洋陶瓷与玻璃技术大会(PacRim8)"微波陶瓷与无限技术"研讨会共同主席，凯恩斯，澳大利亚，2011
Co-Chair of Symposium "Microwave Ceramics and Wireless Technologies" in the 9th Pacific Rim Conference on Ceramic and Glass Technology (PacRim9), Vancouver, Canada, 2009.

7. 第八届环太平洋陶瓷与玻璃技术大会(PacRim8)"电子陶瓷"研讨会共同主席，温哥华，加拿大，2009
Co-Chair of Symposium "Electronic Ceramics" in the 8th Pacific Rim Conference on Ceramic and Glass Technology (PacRim8), Vancouver, Canada, 2009.

8. 第七届环太平洋陶瓷与玻璃技术大会(PacRim7)"电子陶瓷"研讨会共同主席，上海，中国，2007
Co-Chair of Symposium "Electronic Ceramics" in the 7th Pacific Rim Conference on Ceramic and Glass Technology  (PacRim7), Shanghai, China, 2007.

9. 第六届亚洲电子陶瓷会议(AMEC-6)分会主席，筑波，日本，2008
Session Chair of the 6th Asian Meetings on Electroceramics (AMEC-6), Tsukuba, Japan, 2008.

10. 第五届亚洲电子陶瓷会议(AMEC-5)分会主席，曼谷，泰国，2006
Session Chair of the 5th Asian Meetings on Electroceramics (AMEC-5), Bangkok, Thailand, 2006.

11. 第四届亚洲电子陶瓷会议(AMEC-4)分会主席，杭州，中国，2005
Session Chair of the 4th Asian Meetings on Electroceramics (AMEC-4), Hangzhou, China, 2005.

12. 第六届亚洲铁电会议(AMF-6)分会主席，台北，台湾，2008
Session Chair of the 6th Asian Meetings on Ferroelectrics (AMF-6), Taipei, Taiwan, 2008.

13. 第五届亚洲铁电会议(AMF-5)分会主席，野田，日本，2006
Session Chair of the 5th Asian Meetings on Ferroelectrics (AMF-5), Noda, Japan, 2006.

14. 第五届微波材料与应用国际会议(MMA2008)分会主席，杭州，中国，2008
Session Chair of the 5th International Conference on Microwave Materials and Their Applications (MMA2008), Hangzhou, China, 2008

15. 第九届国际铁电畴会议(ISFD-9)分会主席，德累斯顿，德国，2006
Session Chair of the 9th International Symposium on Ferroelectric Domains (ISFD-9), Dresden, Germany, 2006.

16. 2008年国际材料研究大会(IMRS2008)分会主席，重庆，中国，2008
Session Chair of MRS International Materials Research Conference (IMR2008), Chongqing, China, June 9-12.

17. 第四届国际电子陶瓷会议(ICE2009)分会主席，新德里，印度，2009
Session Chair of the 4th International Conference on Electroceramics (ICE2009), New Delhi, India, Dec. 13-17, 2009
18. Session Chair of Joint International Conference on the 7th Asian Meeting on Ferroelectricity and the 7th Asian Meeting on Electroceramics (AMF-AMEC-2010),Jeju Island, Korea, June 28-July 1, 2010.

19. Session Chair of The 19th International Symposium on the Applications of Ferroelectrics and 10th European Conference on the Applications of Polar Dielectrics (ISAF-ECAPD 2010),Edinburgh, August 9-12, 2010.

20. Session Chair of invited talk, The 5th International Conference on Microwave Materials and Their Applications (MMA 2010), Warsaw, September 1-3, 2010.

21. Session Chair of The 3rd International Congress on Ceramics (ICC3),Osaka, Japan, Nov.14-Nov.18, 2010.

22. Session Chair of The 20th IEEE International Symposium on Applications of Ferroelectrics and the International Symposium on Piezoresponse Force Microscopy & Nanoscale Phenomena in Polar Materials (ISAF-2011-PFM), Vancouver, Canada, July 24-27, 2011.

23. Session Chair of invited talk, The 5th International Conference on Electroceramics (ICE2011), Sydney, Australia, December 12-16, 2011.
24. Session Chair of The 6th International Conference on Microwave Materials and Their Applications (MMA 2012), Taipei, Taiwan, June 3-7, 2012.
25.Program Chair of The 8th Asian Meeting on Electroceramics (AMEC-8), Penang, Malaysia, July 2-5, 2012.
26.Session Chair of  The 8th Asian Meeting on Ferroelectrics (AMF-8),  Pattaya, Thailand, December 9-14, 2012.
27.Session Chair of Joint IEEE-International Symposium on the Applications of Ferooelctric and Piezoresponse Force Microscopy and Nanoscale Phenomena in Polar Materials (Joint ISAF-PFM 2013),  Prague, Czech Republic, July 21-25, 2013.
28.Session Chair of Materials Science and Technology Conference and Exhibition 2013 (MS&T'13),  Montreal, Canada, Octber 27-31, 2013.
29. Session Chair of the 23rd IEEE International Symposium on Applications of Ferroelectrics / International Workshop on Acoustic Transduction Materials and Devices / Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM), State College, PA, USA, May 12-16, 2014.
30. Session Chair of the 8th International Conference on Microwave Materials and Their Applications (MMA 2014), Boise, Idaho, USA, June 1-4, 2014.
31. Session Chair of ELECTRONICERAMICS conference (ELECTRONICERAMICS), Bucharest, Romania, June 16-20, 2014.
32. Session Chair of the 9th Asian Meeting on Ferroelectricity and the 9th Asian Meeting on Electroceramics (AMF-AMEC-2014), Shanghai, China, October 26-30, 2014.
33. Session Chair of the 12th International Symposium on Ferroic Domains and Micro-to-Nanoscopic Structures (ISFD-12), Shanghai, China, Nov. 2-5, 2014.
34. Session chair of the 7 th International Conference on Electroceramics (ICE2015), University Park, Penn State, USA, May 13-16, 2015.
35. Session chair and plenary session chair of the 24th IEEE International Symposium on Applications of Ferroelectrics, International Symposium on Integrated Ferroelectrics and the International Symposium on Piezoresponse Force Microscopy (ISAF-ISIF-PFM 2015), Singapore, May 24-27, 2015
36. Session chair of the Materials Science and Technology Conference and Exhibition 2015 (MS&T'15), Ohio State, USA, October 4-8, 2015
37. Co chair of the 1st Sino-German Symposium on Electronic and Memory Materials, Aachen, Germany, Nov.1-4, 2015
38. Chair of  Asian Meeting on Electroceramics in the 2008 ISAF-FMA-AMF-AMEC-PFM Joint Conference (IFAAP 2018), Hiroshima, Japan, May 27-June 1, 2018.
 
特邀报告 (Invited Speaker)

 

1.         Hong Wang, Xi Yao, “Bi-pyrochlore dielectric ceramics for microwave Applications: Current status and future prospect”, 7th European Conference on Applications of Polar Dielectrics (ECAPD7), Librec, Czech, September 6-9, 2004
2.         Hong Wang, “Microwave dielectric behavior of bismuth based low-firing ceramics”, 4th Asian Meeting on Electroceramics (AMEC-4), Hang Zhou, China, June 27-30, 2005
3.         Hong Wang, “Bi-pyrochlore low-firing dielectric ceramics for microwave applications”, 2005 Sino-German Workshop on New Generation Polar Oxide and Devices, Xi’an, Feb.28-Mar.5, 2005
4.         Hong Wang, Xi Yao, “Tailoring the structure and dielectric properties of bismuth-based pyrochlores for RF and microwave applications”, 5th Asian Meeting on Electroceramics (AMEC-5), Bangkok, Thailand, Dec. 10-14, 2006
5.         Hong Wang, “Dielectric relaxation and tunability of Bi1.5ZnNb1.5O7 based cubic pyrochlores ”, 5th Asian Meeting on Ferroelectrics (AMF-5), Noda, Japan, Sep. 3-7, 2006
6.         Hong Wang, “Novel dielectric composites for microwave applications”, 4th International Conference on Microwave Materials and Their Applications (MMA2006), Oulu, Finland, June 12-15, 2006
7.         Hong Wang, “Multifunctional microwave composites”, The 4th International Conference on Electroceramics (ICE2007), Arusha, Tanzania, July 31 to August 3, 2007
8.         Hong Wang, “Novel tunable ceramics and composites”, The 11th European Meeting on Ferroelectricity (EMF-2007), September 3-7, Bled, Slovenia, 2007
9.         Hong Wang, “Low loss dielectric composites for RF and microwave applications”, The 2nd International Workshop on Smart Materials and Structures, August 29-31, Kiel, Germany, 2007
10.     Hong Wang, “Ceramic polymer composites: new develpment in RF range”, 2007 International Forums on Functional Materials, Nov. 15-18, Wuhan, China, 2007
11.     Hong Wang, “Multifunctional composites for microwave applications”, The 5th International Conference on Microwave Materials and Their Applications (MMA2008), Hangzhou, China, November 1 to 4, 2008
12.     Hong Wang, “Low temperature prepared microwave dielectrics for passive integration”, The 6th Asian Meeting on Electroceramics (AMEC-6), Tsukuba, Japan, October 22-24, 2008
13.     Hong Wang, “New development on tunable ceramics and composites”, The 6th Asian Meeting on Ferroelectrics (AMF-6), Taipei, Taiwan, August 2-6, 2008
14.     Hong Wang, “Advances of tunable dielectrics for microwave applications”, The 2th International Symposium on Innovations in Advanced Materials for Optics & Electronics (ISIAMOE-2), Shanghai, China, July 1-5, 2008 
15.     Hong Wang, “Microwave ceramic-polymer composites”, MRS International Materials Research Conference (IMRS2008), Chongqing, China, June 9-12, 2008
16.     Hong Wang, “Multifunctional  composites for microwave applications”, The International Conference on Advanced Functional Materials (ICAFM2007), Trivandrum, India, Dec. 9-10, 2009
17.     Hong Wang, “Mid-High K LTCC Microwave Dielectrics for Passive Integration”, The 4th International Conference on Electroceramics (ICE2009), New Delhi, India, Dec.13-17, 2009
18.     Hong Wang, “Low temperature sintering dielectrics for LTCC applications”, invited talk, Joint International Conference on the 7th Asian Meeting on Ferroelectricity and the 7th Asian Meeting on Electroceramics (AMF-AMEC-2010),Jeju Island, Korea, June 28-July 1, 2010
19.     Hong Wang, “Low loss ceramic-polymer composites for microwave applications”, invited talk, The 19th International Symposium on the Applications of Ferroelectrics and 10th European Conference on the Applications of Polar Dielectrics (ISAF-ECAPD 2010),Edinburgh, August 9-12, 2010
20.     Hong Wang, Feng Xiang, Haibo Yang, Kecheng Li, “Multifunctional composites for microwave applications”, invited talk, The 5th International Conference on Microwave Materials and Their Applications (MMA 2010), Warsaw, September 1-3, 2010.
21.     Hong Wang, “Low temperature sintering dielectrics for passive integration in RF to microwave range applications”, invited talk, The 3rd International Congress on Ceramics (ICC3),Osaka, Japan, Nov.14-Nov.18, 2010.
22.     Hong Wang, “Low temperature sintering dielectrics for LTCC applications”, invited talk, The 20th IEEE International Symposium on Applications of Ferroelectrics and the International Symposium on Piezoresponse Force Microscopy & Nanoscale Phenomena in Polar Materials (ISAF-2011-PFM), Vancouver, Canada, July 24-27, 2011.
23.     Hong Wang, Feng Xiang, Haibo Yang, Kecheng Li, “Multifunctional low-loss composites for RF and microwave applications”, invited talk, The 5th International Conference on Electroceramics (ICE2011), Sydney, December 12-16, 2011.
24.     Hong Wang, Feng Xiang, “Precise measurements of complex permittivity od low-loss dielectric materials at microwave frequencies and extrem temperatures”, invited talk, The 6th International Conference on Microwave Materials and Their Applications (MMA 2012), Taipei, Taiwan, June 3-7, 2012.
25.     Hong Wang, “Low temperature sintering dielectrics for passive integration”, invited talk, The 8th Asian Meeting on Electroceramics (AMEC-8), Penang, Malaysia, July 2-5, 2012.
26.     Hong Wang, “Fabrication and electromagnetic properties of 3D photonic crystals for microwave applications”, invited talk, The 8th Asian Meeting on Ferroelectrics (AMF-8),  Pattaya, Thailand, December 9-14, 2012.
27.     Hong Wang, Wei Dai, “Fabrication and electromagnetic properties of 3D electromagnetic bandgap structures”, invited talk, Joint IEEE-International Symposium on the Applications of Ferroelctric and Piezoresponse Force Microscopy and Nanoscale Phenomena in Polar Materials (Joint ISAF-PFM 2013), Prague, Czech Republic, July 21-25, 2013.
28.     Hong Wang, “Multifunctional low-loss electromagnetic oxide composites”, invited talk, Materials Science and Technology Conference and Exhibition 2013 (MS&T'13),  Montreal, Canada, Octber 27-31, 2013.
29.   Hong Wang, Feng Xiang, “Novel LTCC dielectrics for passive integration”, invited talk, The 8th International Conference on Microwave Materials and Their Applications (MMA 2014), Boise, Idaho, USA, June 1-4, 2014.
30.   Hong Wang, “Novel microwave dielectric ceramics for applications in passive integration”, invited talk, ELECTRONICERAMICS conference (ELECTRONICERAMICS), Bucharest, Romania, June 16-20, 2014.
31.   Hong Wang, “Low-firing microwave dielectric ceramics for applications in passive integration”, invited talk, The 5th International Congress on Ceramics (ICC5), Beijing, China, August 17-21, 2014.
32.   Hong Wang, “Low-loss magnetodieelctric composites for RFand microwave applications”, invited talk, Progress In Electromagnetic Research Symposium (PIERS2014), Guangzhou, China, August 25-28, 2014.
33. Hong Wang, “Novel dielectric materials with ultra-low sintering temperatures for passive integration applications”, invited talk, The 9th Asian Meeting on Ferroelectricity and the 9th Asian Meeting on Electroceramics (AMF-AMEC-2014), Shanghai, China, October 26-30, 2014.
34.   Hong Wang, “Ultra-low temperature cofiring ceramics for passive integration applications”, invited talk, The 12th International Symposium on Ferroic Domains and Micro-to-Nanoscopic Structures (ISFD-12), Shanghai, China, Nov. 2-5, 2014.
35.   Hong Wang, “Advances of ultra-low temperature cofiring ceramics for passive integration applications”, invited talk, The 7 th International Conference on Electroceramics (ICE2015), University Park, Penn State, USA, May 13-16, 2015
36.   Hong Wang, “Polymer-based dielectric nanocomposites with high thermal conductivity for electronic packaging applications”, invited talk, The 24th IEEE International Symposium on Applications of Ferroelectrics, International Symposium on Integrated Ferroelectrics and the International Symposium on Piezoresponse Force Microscopy (ISAF-ISIF-PFM 2015), Singapore, May 24-27, 2015
37.   Hong Wang, “Multifunctional low-loss magneto-dielectric oxide ceramics”, invited talk, Materials Science and Technology Conference and Exhibition 2015 (MS&T'15), Ohio State, USA, October 4-8, 2015
38.   Hong Wang, “Novel Dielectric Materials for Passive Integration and Energy Storage”, invited talk, The 1st Sino-German Symposium on Electronic and Memory Materials, Aachen, Germany, Nov.1-4, 2015
39.    Hong Wang, “Advances of ultra-low temperature cofiring ceramics for passive integration applications”, invited talk, IMAPS/ACerS 12th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2016), Denver, USA, April.19-21, 2016
40.    Hong Wang, “Multifunctional ceramic-based composites”, invited talk, NSF Workshop on Emerging Opportunities in Ceramics and Glass Science, Arlington, Virginia State, USA, September.12-14, 2016
41.   Hong Wang, “Novel microwave dielectric ceramics with ultra-low sintering temperatures”, invited talk, Materials Science and Technology Conference and Exhibition 2016 (MS&T'16), Salt City Lake, Utah State, USA, October 23-27, 2016
42.  Hong Wang, “Ultra-low Temperature Cofiring Ceramics for Microwave Passive Integration”, Keynote, The 10th Asian Meeting on Electroceramics(AMEC-2016)，Taipei，Dec.4-7, 2016