论文期刊

论文标题    Copper Direct Drilling with TEA CO2 Laser in Manufacture of High Density Interconnection Printed
作者    X.Y.Fang, K.C.Yung
发表/完成日期    2010-03-04
期刊名称    IEEE transaction on eletronics packaging ...
期卷    29
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论文简介    abc