Enhancement of flow-jet combined boiling heat transfer of FC-72 over micro-pin-finned surfaces

作者: Yonghai Zhang, Jinjia Wei*, Dong Guo
发表/完成日期: 2012-01-24
期刊名称: Journal of enhanced Heat Transfer. 2012, 19(6): 489-503.
期卷: 19(6)
For highly efficient solving of the power dissipation problem of electronic components with high heat flux, experimental study of the flow-jet combined boiling heat transfer on silicon chips was conducted. Micro-pin-fins with dimensions of 30×60 µm2 and 30×120 µm2 (thickness × height) were fabricated on the chip surfaces by the dry etching technique. The experiments were made at three different cross-flow velocities Vc (0.5, 1.0, 1.5 m/s) and different jet velocities Vj (0–2 m/s) with two liquid subcooling ∆Tsub (25◦C and 35◦C). A smooth surface was also tested for comparison. The micro-pin-fins showed a considerable heat transfer enhancement due to an increase in effective heat transfer surface area caused by micro-convection around micro-pin-fins. The maximum allowable heat flux qmax is increased and the wall superheat is decreased greatly. For a given Vc, the heat transfer enhancement is more significant as Vj increases, but the qmax increment decreases as Vc increases. The fin efficiency decreases as Vc or/and Vj increases or the heat flux q increases. The maximum qmax can reach 161 W/cm2 at Vc = 1.5 m/s, Vj = 2 m/s,∆Tsub = 35◦C for chip PF30-120.
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