招生信息

硕士生招生(4人/年)
机械工程学院(机械制造及其自动化08020101增材制造技术、 数字化产品开发与制造

博士生招生(2人/年)
机械工程学院(机械工程080200增材制造技术、数字化产品开发与快速制造、微流体器件设计与制造 

 数字化产品开发:包括微细产品快速设计与制作、基于自主学习的智能控制技术

增材制造研究方向:包括轻质金属3D打印技术和食品3D技术研究

注:报考条件和考试科目详见西安交通大学硕士生博士生招生目录。http://gs.xjtu.edu.cn/zhaos/

欢迎材料、机械、材料、流体力学、传热传质、计算机、自动控制专业学生报考

 

讲授课程

 讲授院级主干课程《机械制造技术基础》

核心课《科技写作与表达》

研究生课程《增材制造技术》
  工程硕士《机械工程英语》


 指导研究生45人(已毕业31人),合作指导研究生11人(已毕业12人);
 指导博士生11(已毕业3人)

 指导本科生生产实习并获优秀实习队;
 每年指导本科生毕业设计。

   

论文期刊
论文标题 作者 发表/完成日期 期刊名称
Numerical simulation and parametric analysis of selective laser melting process of AlSi10Mg powder Pei Wei, Zhengying Wei, Zhen Chen,2017-07-10Applied Physics A
Thermal behavior in single track during selective laser melting of AlSi10Mg powder Pei Wei, Zhengying Wei, Zhen Chen2017-06-29Applied Physics A
Improved Online Sequential Extreme Learning Machine for Simulation of Daily Reference Evapotranspiration Yubin Zhang, Zhengying Wei, Lei Zhang ,QinyinLin2017-06-15TECNOLOGIA Y CIENCIAS DEL AGUA
The AlSi10Mg samples produced by selective laser melting: single track, densification, microstructure and mechanical behavior Pei Wei, Zhengying Wei, Zhen Chen,2017-02-20Applied Surface Science
New rock material definition strategy for FEM simulation of the rock cutting process by TBM disc cutters Geng Q, Wei ZY, Ren JH2017-01-01Tunnelling and Underground Space Technology
Flow characteristic of in-flight particles in supersonic plasma spraying process Pei Wei, Zhengying Wei, Guangxi Zhao2016-11-15Heat & Mass Transfer,
A novel high-efficiency methodology for metal additive manufacturing Jun DU, Zhengying WEI, Xin WANG, Xuewei FANG, Guangxi Zhao. 2016-09-01Applied Physics A
Numerical and experimental investigation of molten metal droplet deposition applied to rapid prototyping SuLi Li, ZhengYing Wei, Jun Du, Guangxi Zhao, Xin Wang, BingHeng Lu.2016-05-29Applied Physics A
An improved fused deposition modeling process for forming large-size thin-walled parts [J]. Journal of Materials Processing Technology DU Jun, WEI Zhengying, WANG Xin, WANG Jijie, CHEN Zhen2016-05-09Journal of Materials Processing Technology
Validation of the lattice Boltzmann method implementation in a drip emitter[ Shengli Ma, Zhengying Wei2016-03-29Transactions of the ASABE
Building of nested components by a double-nozzle droplet deposition process SuLi Li, ZhengYing Wei, Jun Du, Guangxi Zhao, Xin Wang, BingHeng Lu.2016-03-14Applied Physics A
Numerical analysis of pileup process in metal microdroplet deposition manufacture Jun DU, Zhengying WEI2015-02-02International Journal of Thermal Sciences
Reverse Nonequilibrium Molecular Dynamics Calculation of the Resist Shear Viscosity in UV-Nanoimprint Lithography[J]. Du Jun, WEI Zhengying, TANG Yiping. 2013-10-14Journal of Computational and Theoretical Nanoscience
Visualization of resist flow fields in microlithography by using defocusing digital particle image velocimetry[J] Du Jun, Wei Zhengying, Li Shize, Tang Yiping.2013-07-11Journal of Micro/Nanolithography,
Analysis on the Lubrication Performances of Journal Bearing System Using Computational Fluid Dynamics and Fluid–Structure Interaction Considering Thermal Influence and Cavitation[J] Qiyin Lin, Zhengying Wei, Ning Wang, Wei Chen. 2013-07-08Tribology International,
Resist deformation and flow fields in microimprint lithography[J] DU Jun, WEI Zhengying, LI Shize and TANG Yiping2013-05-20Journal of Micromechanics and Microengineering
Investigation of resist filling behavior in microimprint lithography by CFD simulation and defocusing digital particle image velocimetry[J] Jun DU, Zhengying WEI, Shize LI, et al2013-02-19Journal of Vacuum Science & Technology B.
Effects of Mold Geometries and Initial Resist Thickness on Filling Behavior in UV-Nanoimprint Lithography[J]. Du J, Wei Z, He W, et al.2012-08-15Journal of Computational and Theoretical Nanoscience,
Flow Behaviour Analysis and Experimental Investigation for Emitter Micro-channels.[J]. Wei Zhengying,Cao Meng,Liu Xia,Tang Yiping,Lu Bingheng2012-04-27Chinese Journal of Mechanical Engineering.
Numerical Simulation and Experimental Study on Resist Filling Behavior in UV-nanoimprint Lithography [J]. Du J, Wei Z, Tang Y. 2012-03-19Procedia CIRP,
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