Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
- 发表刊物：
- Microgravity Science and Technology
- 摘要：
- https://doi.org/10.1007/s12217-023-10082-9
- 合写作者：
- Shuai Wang, Xiang Ma*, Quan Gao, Jinyu Wang, Na Xu*, Yonghai Zhang, Jinjia Wei, Jianfu Zhao, Bin Li
- 是否译文：
- 否
- 发表时间：
- 2023-10-23