Incorporating negative thermal expansion Cu2V2O7 into epoxy to achieve low thermal expansion and high thermal conductivity
发布时间：2026-09-07
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- 发布时间：
- 2026-09-07
- 文章标题：
- Incorporating negative thermal expansion Cu2V2O7 into epoxy to achieve low thermal expansion and high thermal conductivity
- 内容：
Junqi Li, Feiyu Qin, Yiping Lv, Xin Yang, Tianhang Wu, Xiaoling Wang, Wenhui Xu, Nianjie Liu, Jun Wang, Lei Hu*, Jun Sun, Xiangdong Ding. Journal of Alloys and Compounds, 2025, 1013 178601.
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