Ultra-thin and Heat Resistant Absorber with Multi-sized Through-holes
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Ultra-thin and Heat Resistant Absorber with Multi-sized Through-holes
- 发表刊物：
- 2021 IEEE 4th International Conference on Electronic Information and Communication Technology (ICEICT)
- 合写作者：
- Y. Liu and J. Chen
- 是否译文：
- 否
- 发表时间：
- 2021-08-19