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Paper Name Author Publication/Completion Time Magazine Name
Three-dimensional numerical simulation of heat transfer enhancement of electronic devices by single crystal diamond rhombus-shaped pin fin microchannel heat sink J Yuan, YF Qu, NK Deng, L Du, WB Hu*, XF Zhang, SL Wu, HX Wang 2024-03-25 Diamond and Realted Materials
Thermal effect of Nd:YAG bonded on diamond by Mo/Au metal intermediate layer at room temperature NK Deng, YF Qu, J Yuan, WB Hu*, ZY Zhang, HX Wang 2024-01-09 Optical Materials
Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, SL Wu, HX Wang 2024-01-07 Journal of Materials Engieering and Performance
3D structure of box-and-grid electron multiplier with higher electron collection efficiency ZC Xia, YR Wang, YW Peng, J Li, WB Hu, X Zhong, SL Wu 2024-01-01 Journal of Vacuum Science and Technology B
Secondary electron emission enhancement of MgO-Au composite film by SiO2 doping in MgO surface layer L Liu, J Li, KJ Ma, BY Liu, YZ Xue, WB Hu*, SL Wu, HQ Fan 2023-11-28 Materials Letters
Heat transfer properties of single crystal diamond zigzag double-layer microchannel heat sinks L Du, J Yuan, NK Deng, YF Qu, XF Zhang, WB Hu* 2023-11-26 International Journal of Thermal Sciences
Three-dimensional numerical investigation of flow and heat transfer performances of novel straight microchannel heat sinks J Yuan, YF Qu, NK Deng, L Du, WB Hu*, XF Zhang, SL Wu, HX Wang 2023-11-06 Diamond and Related Materials
Effect of diamond cap thickness on temperature distribution and thermal aberration of thin disk Nd:YAG laser crystal NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, ZY Zhang, HX Wang 2023-08-31 Diamond and Related Materials
Effect of the thickness of amorphous silicon intermediate layer on the thermal transport of silicon/diamond interface YF Qu, J Yuan, NK Deng, WB Hu*, SL Wu, HX Wang 2023-08-31 Results in Physics
An overview of heat transfer enhancement methods in microchannel heat sinks L Du, WB Hu* 2023-08-18 Chemical Engineering Science
Investigation on the thermal aberration of Nd:YAG on SiC fabricated by room temperature bonding with a Mo/Au nano-interlayer NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, ZY Zhang, SL Wu, HX Wang 2023-08-10 Optical Materials Express
Effects of argon plasma pretreatment of Si wafers on Si-Si bonding based on Mo/Au interlayers YF Qu, HY Bai, WB Hu*, Y Yuan, SL Wu, HX Wang, HQ Fan 2023-05-28 Surface Topography-Metrology and Properties
Room temperature bonding of diamond/Si with Mo/Au interlayers in atmospheric air F Wang, K Wang, GQ Chen, F Lin, RZ Wang, W Wang, MH Zhang, WB Hu*, HX Wang* 2023-04-15 Diamond and Related Materials
High-threshold-voltage and low-leakage-current of normally-off H-diamond FET with self-aligned Zr/ZrO2 gate F Wang, GQ Chen, W Wang, MH Zhang, S He, GQ Shao, YF Wang, WB Hu, HX Wang* 2023-03-20 Diamond and Related Materials
Enhanced thermal stability of Ga2O3 MOSFETs with nanocrystalline diamond field plate YF Qu, BQ Ren, J Yuan, NK Deng, WB Hu*, HX Liu, Y Yuan, SL Wu,HX Wang 2023-03-08 Diamond and Related Materials
Electron-induced secondary electron emission of aluminum alloy processed via the combination of alodine treatment and carbon film deposition J Li, BY Liu, SL Wu, YD Li,WB Hu* 2023-02-12 Materials Letters
Effect of the Surface Morphology of Porous Coatings on Secondary Electron Yield of Metal Surface M Peng, S Lin, CX Zhang, HF Liang, CL Liu, M Cao,WB Hu, YG Zhai, YD Li 2022-07-03 Materials
Highly transparent oxide-based ultraviolet photodetectors for flexible electronics YJ Li, HL Ma, WB Hu, YQ Zhao 2022-06-22 Journal of Materials Science-Materials in Electronics
Electrical and Thermal Characteristics of AlGaN/GaN HEMT Devices with Dual Metal Gate Structure: A Theoretical Investigation YF Qu,NK Deng, Y Yuan, WB Hu*, HX Liu, SL Wu, HX Wang 2022-06-18 Materials
Argon Ion Beam Current Dependence of Si-Si Surface Activated Bonding S Yang, NK Deng, YF Qu, K Wang, Y Yuan, WB Hu*, SL Wu, HX Wang 2022-05-20 Materials
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