Research Center | 研究中心

Wide Bandgap Power Semiconductor Device Packaging and Integration Research Center (WBG Center)

宽禁带功率半导体器件封装集成研究中心（WBG Center）

The Wide Bandgap Power Semiconductor Device Packaging and Integration Research Center (WBG Center) is affiliated with the Power Electronics and Renewable Energy Research Center (PEREC) at Xi'an Jiaotong University and is directed by Prof. Laili Wang. The Center focuses on research in wide-bandgap (SiC/GaN) power semiconductor devices, advanced packaging and heterogeneous integration, thermal management, reliability, electromagnetic compatibility (EMC), and high-performance power electronic systems. Since 2023, the Center has collaborated with the Shaoxing Municipal Government to establish the Xi'an Jiaotong University–Shaoxing Tongyue Wide Bandgap Semiconductor Research Institute, promoting innovation, technology transfer, and the industrialization of next-generation wide-bandgap semiconductor technologies.

宽禁带功率半导体器件封装集成研究中心（WBG Center）隶属于西安交通大学电力电子与可再生能源研究中心（PEREC），由王来利教授担任中心主任。研究中心围绕宽禁带功率半导体（SiC/GaN）器件、先进封装与异构集成、热管理、可靠性、电磁兼容（EMC）以及高性能电力电子系统等方向开展研究。自2023年以来，中心与绍兴市政府合作共建西安交通大学—绍兴通越宽禁带半导体研究院，致力于推动宽禁带半导体关键技术创新、科技成果转化及产业化发展。

Research Areas | 研究方向

• Power Electronics and Energy Systems
  电力电子与能源系统

• Wireless Power Transfer (WPT) Systems
  无线电能传输（无线充电）系统

Contact | 联系方式

• Email | 电子邮箱:houran@xjtu.edu.cn

• Office | 办公地址:Room 219, East Building 1, Xingqing Campus, Xi'an Jiaotong University
  西安交通大学兴庆校区东一楼219室