王来利
- E-Mail: bd3eefe41e3f164e3da1afd9aba983d4fffd6e540d19200b43b32955a5555556f683c299389eea0613403efb4ba1897b7626b7a6409392e68c643957346eab0be2c1e662283d2dc5ecf827637b864c3c767a37354c2b56bfd3bfc1bda22ed648a63a211ab59aa10c9291adf07a9f1a49e6ff77596ece44ac9ab3bce841c16c28
- School/Department: 电气工程学院
- Education Level: With Certificate of Graduation for Doctorate Study
- Gender: Male
- Degree: Doctor
- Professional Title: Professor
- Status: Employed
- Supervisor of Doctorate Candidates: Yes
- Supervisor of Master's Candidates: Yes
一种双面散热芯片倒装的气密性耐高温封装结构
Release Time:2025-04-30
Hits:
- Title:
- 一种双面散热芯片倒装的气密性耐高温封装结构
- Disigner of the Invention:
- 王来利 , 朱梦宇 , 杨成子 , 孔航 , 郭伟力 , 杨奉涛 , 齐志远 , 伍敏
- Type of Patent:
- Invent
- Application Number:
- CN202210039284.X
- Service Invention or Not:
- No
- Application Date:
- 2022-01-13
- Date:
- 2025-04-30
