Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed
- 发表刊物：
- IEEE Journal of Emerging and Selected Topics in Power Electronics
- 合写作者：
- B. Li, X. Yang, Y. Yao, K. Wang, L. Wang and W. Chen
- 是否译文：
- 否
- 发表时间：
- 2024-04-30