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论文期刊

论文标题    Room temperature bonding of Si and Si wafers by using Mo/Au nano-adhesion layers
作者    Kang Wang, Kun Ruan, Wenbo Hu*, Shengli Wu, Hongxing Wang
发表/完成日期    2019-05-27
期刊名称    Microelectronic Engineering
期卷   
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论文简介    aa
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