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论文期刊

论文标题    Room temperature bonding of GaN on diamond wafers by using Mo/Au nano-layer for high-power semiconductor devices
作者    Kang Wang, Kun Ruan, Wenbo Hu*, Shengli Wu, Hongxing Wang
发表/完成日期    2019-08-24
期刊名称    Scripta Materialia
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