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论文期刊

论文标题    Investigation on the bonding quality of GaN and Si wafers bonded with Mo/Au nano-layer in atmospheric air
作者    Kang Wang, Kun Ruan, Haiyang Bai, Wenbo Hu*, Shengli Wu, Hongxing Wang
发表/完成日期    2020-04-01
期刊名称    Materials Science in Semiconductor Processing
期卷    114
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