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团队开设全英文研究生课程
发布者: 侯予 | 2015-06-16 | 34

 

为了适应科学技术发展且保证研究生课程质量，根据学校《西安交通大学关于深化研究生教育综合改革的实施意见》（西交研〔2014〕101号）、《西安交通大学研究生课程管理办法》（西交研〔2013〕38号）和《西安交通大学教育教学改革研究项目管理办法》（西交教〔2006〕16号）的文件精神，团队课程组将在秋季学期开设《电子器件冷却及数据中心制冷技术（Thermal Management and Cooling Technology of Electronic Packages and Data Centers）》全英文课程。
《Thermal Management and Cooling Technology of Electronic Packages and Data Centers》全英文课程将面向全院留学生及动力工程及工程热物理一级学科方向的研究生授课，欢迎广大研究生同学选报。
 
Thermal Management and Cooling Technology of Electronic Packages and Data Centers
Thermal management is one of the critical issues for the development of advanced electronic devices/systems and data centers. This course covers a comprehensive knowledge of the key cooling techniques and refrigeration technologies at multiple scales which spans from electronic package to data center. The thermal issues involved in the thermal management of electronic devices are first introduced. The operation processes and working principles of various cooling techniques are discussed including the air cooling, micro-channel cooling, spray cooling, heat pipes, miniature refrigeration cooling, and thermal-electric cooling. Finally, the air conditioning systems including mechanical refrigeration systems and natural cooling systems are discussed for the application in thermal management of data center. The course also includes an experiment on spray cooling and a project of numerical modeling a typical electronic package.
 
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