CMUTs芯片机-电-声多物理场耦合机理及结构设计研究
Release Time:2025-04-30
Hits:
- Project Name:
- CMUTs芯片机-电-声多物理场耦合机理及结构设计研究
- Status:
- 进行中
- Classification of Project:
- Vertical project
- Project Source:
- National Key R&D Program Sub-project
- Project Number:
- 2023YFF0720801HZ
- Date of Project Approval:
- 2023-12-01
- Date of Project Completion:
- 2026-11-01
- Subsidy Amount(Wan Yuan):
- 45.0
- Date:
- 2025-04-30
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