一种具有显微扩散阻挡层的铜/硅封装材料及其制备方法
Release Time:2025-04-30
Hits:
- Title:
- 一种具有显微扩散阻挡层的铜/硅封装材料及其制备方法
- Disigner of the Invention:
- 王亚平，蔡辉，宋晓平，丁秉钧
- Type of Patent:
- Invent
- Application Number:
- 2008101510449
- Service Invention or Not:
- No
- Application Date:
- 2008-11-23
- Date:
- 2025-04-30
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