. J Yuan, YF Qu, NK Deng, L Du, WB Hu*, XF Zhang, SL Wu, HX Wang . Three-dimensional numerical simulation of heat transfer enhancement of electronic devices by single crystal diamond rhombus-shaped pin fin microchannel heat sink , Diamond and Realted Materials , 2024 , 143 : 110887

. NK Deng, YF Qu, J Yuan, WB Hu*, ZY Zhang, HX Wang . Thermal effect of Nd:YAG bonded on diamond by Mo/Au metal intermediate layer at room temperature , Optical Materials , 2024 , 147 : 114695

. NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, SL Wu, HX Wang . Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation , Journal of Materials Engieering and Performance , 2024

. ZC Xia, YR Wang, YW Peng, J Li, WB Hu, X Zhong, SL Wu . 3D structure of box-and-grid electron multiplier with higher electron collection efficiency , Journal of Vacuum Science and Technology B , 2024 , 41(6) : 064205

. L Liu, J Li, KJ Ma, BY Liu, YZ Xue, WB Hu*, SL Wu, HQ Fan . Secondary electron emission enhancement of MgO-Au composite film by SiO2 doping in MgO surface layer , Materials Letters , 2023 , 355 : 135448

. L Du, J Yuan, NK Deng, YF Qu, XF Zhang, WB Hu* . Heat transfer properties of single crystal diamond zigzag double-layer microchannel heat sinks , International Journal of Thermal Sciences , 2023 , 196 : 108687

. J Yuan, YF Qu, NK Deng, L Du, WB Hu*, XF Zhang, SL Wu, HX Wang . Three-dimensional numerical investigation of flow and heat transfer performances of novel straight microchannel heat sinks , Diamond and Related Materials , 2023 , 140 : 110479

. YF Qu, J Yuan, NK Deng, WB Hu*, SL Wu, HX Wang . Effect of the thickness of amorphous silicon intermediate layer on the thermal transport of silicon/diamond interface , Results in Physics , 2023 , 52 : 106827

. NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, ZY Zhang, HX Wang . Effect of diamond cap thickness on temperature distribution and thermal aberration of thin disk Nd:YAG laser crystal , Diamond and Related Materials , 2023 , 138 : 110197

. L Du, WB Hu* . An overview of heat transfer enhancement methods in microchannel heat sinks , Chemical Engineering Science , 2023 , 280 : 119081