江峰
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  • 所在单位:材料科学与工程学院
  • 学历:博士研究生毕业
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  • 学位:博士
  • 学科:材料科学与工程
  • 学科:材料科学与工程
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祝贺博士生杨中岳关于铜合金的论文在Journal of Materials Research and Technology 上正式发表!
  • 发布时间:2024-12-30
  • 文章标题:祝贺博士生杨中岳关于铜合金的论文在Journal of Materials Research and Technology 上正式发表!
  • 内容:
    Effects of micron-sized Cr3Si particles on microstructure and properties of
    CuNiSiCr alloy
    Zhongyue Yang a , Yake Wu a , Liang Zhou b , Bai Li c , Feng Jiang a,* , Junyong Lu c,**
    a State Key Laboratory for Mechanical Behavior of Materials, Xian Jiaotong University, Xian, 710049, China
    b School of Materials Science and Engineering, Changan University, Xian, 710064, China
    c National Key Laboratory of Electromagnetic Energy, Naval University of Engineering, Wuhan, 430033, China
     
    ABSTRACT
    The microstructure evolution and properties of CuNiSi and CuNiSiCr alloys were systematically compared to
    understand the effects of micron-sized Cr3Si particles during thermomechanical processing. It was found that the
    Cr3Si particles complexified the structure of the deformation bands and induced particle deformation zones after
    cold rolling. These deformation heterogeneities increased the number of nucleation sites and resulted in more
    significant grain refinement in the CuNiSiCr alloy upon recrystallization. As for textures, the Cr3Si particles did
    not alter the components but weakened their intensities. Analysis of grain growth kinetics revealed that Cr3Si
    particles can hinder grain growth and even restrict the grain size to a fine scale, thus enhancing the grain size
    stability at high temperatures. After aging, the fine-grained CuNiSiCr alloy showed an elevated work hardening
    rate, improving the ultimate tensile strength and elongation. This study highlights the potential of using micron
    sized particles to design high-performance copper alloys, offering valuable insights for applications in electrical
    and electronic industries.
     
    该论文受到国家自然科学基金的资助。