内容:
Effects of micron-sized Cr3Si particles on microstructure and properties of
CuNiSiCr alloy
Zhongyue Yang a , Yake Wu a , Liang Zhou b , Bai Li c , Feng Jiang a,* , Junyong Lu c,**
a State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an, 710049, China
b School of Materials Science and Engineering, Chang’an University, Xi’an, 710064, China
c National Key Laboratory of Electromagnetic Energy, Naval University of Engineering, Wuhan, 430033, China
ABSTRACT
The microstructure evolution and properties of CuNiSi and CuNiSiCr alloys were systematically compared to
understand the effects of micron-sized Cr3Si particles during thermomechanical processing. It was found that the
Cr3Si particles complexified the structure of the deformation bands and induced particle deformation zones after
cold rolling. These deformation heterogeneities increased the number of nucleation sites and resulted in more
significant grain refinement in the CuNiSiCr alloy upon recrystallization. As for textures, the Cr3Si particles did
not alter the components but weakened their intensities. Analysis of grain growth kinetics revealed that Cr3Si
particles can hinder grain growth and even restrict the grain size to a fine scale, thus enhancing the grain size
stability at high temperatures. After aging, the fine-grained CuNiSiCr alloy showed an elevated work hardening
rate, improving the ultimate tensile strength and elongation. This study highlights the potential of using micron
sized particles to design high-performance copper alloys, offering valuable insights for applications in electrical
and electronic industries.
该论文受到国家自然科学基金的资助。