Online Condition Monitoring of Bonding Wires Lift-Off in Power Modules Based on Magnetic Field Measurement
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Online Condition Monitoring of Bonding Wires Lift-Off in Power Modules Based on Magnetic Field Measurement
- 发表刊物：
- IEEE Transactions on Power Electronics
- 合写作者：
- W. Guo, G. Xiao and L. Wang
- 是否译文：
- 否
- 发表时间：
- 2024-11-21