A Novel Condition Monitoring Method for Full Modes of Package Degradation in High Power Modules Based on Hysteresis Curves of Forward Voltage Drop
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- A Novel Condition Monitoring Method for Full Modes of Package Degradation in High Power Modules Based on Hysteresis Curves of Forward Voltage Drop
- 发表刊物：
- IEEE Transactions on Power Electronics
- 合写作者：
- Yuchen Wang; Hong Zhang; Jianpeng Wang; Jin Zhang; Tianjian Wang; Yi Liu; Laili Wang; Yunqing Pei; Xiaoliang She; Jinjun Liu
- 是否译文：
- 否
- 发表时间：
- 2024-11-27