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论文期刊

论文标题    Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation
作者    NK Deng, YF Qu, J Yuan, Y Yuan, WB Hu*, SL Wu, HX Wang
发表/完成日期    2024-01-07
期刊名称    Journal of Materials Engieering and Performance
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