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论文期刊

论文标题    Effects of argon plasma pretreatment of Si wafers on Si-Si bonding based on Mo/Au interlayers
作者    YF Qu, HY Bai, WB Hu*, Y Yuan, SL Wu, HX Wang, HQ Fan
发表/完成日期    2023-05-28
期刊名称    Surface Topography-Metrology and Properties
期卷    11(2)
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