Collaborators

  • Gang Hua, IEEE&IAPR Fellow, ACM Distinguished Scientist, Vice President and Chief Scientist, Wormpex AI Research, BianLiFeng (便利蜂), Bellevue, WA 98004, USA. 2010 -.
  • Ying Wu, IEEE&IAPR Fellow, Professor, Electrical Engineering & Computer Science, Northwestern University, Evanston, IL 60208, USA. 2016 -.
  • Junsong Yuan, IEEE&IAPR Fellow, Professor, Director of Visual Computing Lab, Computer Science and Engineering, State University of New York at Buffalo, NY 14260, USA. 2019 -.
  • Qilin Zhang, Research Engineer, Apple, Cupertino, CA, USA. 2017 -.
  • Wei Tang, Assistant Professor, Computer Science, University of Illinois at Chicago, Chicago, IL 60607, USA. 2019 -.
  • Chengjiang Long, Research Scientist in Meta Reality Labs (formerly Facebook Reality Labs), Burlingame, CA 94010, USA. 2019 -.

Students

招生要求：有追求，数学好，编程好，英语好

 

Ph.D. Students 

  • Liushuai Shi, 2019.09 -. 
    • Publications: CVPR'2021, AAAI'2022, T-PAMI'2023. 
    • Patents: one patent issued, one patent pending.
    • Honors: National Scholarship/国家奖学金.
  • Haoxuanye Ji, 2020.09 -.  
    • Publications: ICCV'2021.
    • Patents: one patent issued, one patent pending.
  • Kun Xia, 2020.09 -. 
    • Publications: CVPR'2022, PR'2022, T-MM'2023.
    • Patents: three patents pending. 
  • Haoyue Shi, 2021.03 -.
    • Publications: PR'2022, BMVC'2020.
    • Patents: one patent issued, two patents pending. 
    • Honors: Baosheng Hu Scholarship/胡保生奖学金.
  • Zheng Qin, 2021.09 -.
    • Publications: CVPR'2023.
  • Yonghao Dong, 2021.09 -. (Co-supervise with Prof. Changyin Sun)

Master Students

  • Zixin Zhu, 2020.09 -. 
    • Publications: ICCV'2021, AAAI'2022, T-PAMI'2023. 
    • Patents: two patents pending. 
    • Honors: National Scholarship/国家奖学金.
  • Bingxu Mu, 2020.09 -.
    • Publications: CVPR'2023.
    • Patents: one patent pending.
  • Jinghai Duan, 2020.09 -. 
    • Publications: AAAI'2022.
    • Patents: one patent pending.
  • Xuelu Feng, 2020.09 -. 
    • Publications: PRL'2022.
    • Patents: one patent pending.
  • Xuan Du, 2021.09 -.
  • Xingyu Liu, 2021.09 -.
  • Qianxiong Ning, 2021.09 -.
  • Kuai Wang, 2021.09 -.
  • Panpan Fu, 2021.09 -.
  • Qi Xi, 2021.09-. (Co-supervise with Prof. Changyin Sun)
  • Pengfei Wu, 2021.09-. (Co-supervise with Prof. Changyin Sun)
  • Zhengdan Yin, 2021.09-. (Co-supervise with Prof. Changyin Sun)
  • Xiaolong Sun, 2022.09-.
  • Mengnan Liu, 2022.09-.
  • Zhanheng Gao, 2022.09-.
  • Qi Wu, 2022.09-.
  • Kun Zhang, 2022.09-.
  • Mingkun Dai, 2022.09-. (Co-supervise with Prof. Changyin Sun)
  • Yuanlong Liu, 2022.09-. (Co-supervise with Prof. Changyin Sun)

Alumni

Ph.D.
  • Zhanning Gao, Ph.D. 2012-2018. (Co-supervise with Prof. Gang Hua and Prof. Nanning Zheng)
    • Researcher, DAMO Academy, Alibaba Group, Beijing, China.
    • Publications: T-PAMI'2019, AAAI'2019, CVPR'2017. 
    • Patents: one patent issued. 
    • Honors: 西安交通大学“信源通”高水平论文奖, 人机所之星. 
  • Ziyi Liu, Ph.D. 2015-2021. (Co-supervise with Prof. Nanning Zheng)
    • Researcher, Wormpex AI Research, BianLiFeng, Beijing, China.
    • Publications: T-PAMI'2021, AAAI'2021*2, ICCV'2019, T-IP'2018, etc.
    • Patents: one patent issued.
    • Honors: National Scholarship/国家奖学金, 西安交通大学“信源通”高水平论文奖, 人机所之星.
Master
  • Xin Lv, M.S. 2015 - 2018.
    • Engineer, Xi'an Jiaotong University, Xi'an, China.
    • Publications: T-MM'2020, ICIP'2018.
    • Patents: one patent issued.
  • Xuhuan Duan, M.S. 2015 - 2018.
    • Engineer, China Merchants Bank, Shenzhen, China.
    • Publications: ICIP'2018.
    • Honors: 西安交通大学优秀硕士学位论文.
  • Jinliang Zang, M.S. 2016 - 2019.
    • Engineer, DeepNorth, Xi'an, China.
    • Publications: AIAI'2018. 
    • Patents: one patent pending.
    • Honors: 沈亚鹏奖学金.
  • Yinhe Sheng, M.S. 2016 - 2019.
    • Ph.D. candidate, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences.
    • Publications: ACM ICBRA'2018, IEEE ICBCB'2019.
  • Changbo Zhai, M.S. 2017 - 2020. 
    • Engineer, Shanghai Pudong Development Bank, Xi'an, China.
    • Publications: Neurocomputing'2020, MMM'2020.
    • Patents: two patents issued.
  • Rizhi Ding, M.S. 2017 - 2020.
    • Engineer, BianLiFeng, Beijing, China.
    • Publications: T-IP'2021, ICASSP'2020. 
    • Patents: one patent issued.
  • Xinling Liu, M.S. 2017 - 2020.
    • Engineer, UNISOC, Xi'an, China.
    • Publications: AIAI'2020.
    • Patents: one patent issued. 
    • Honors: 西安交通大学优秀研究生.
  • Panchao Lai, M.S. 2017 - 2020.
    • Engineer, Huawei Xi'an Research Institute, Xi'an, China.
    • Project: Design and implementation of intelligent advertisement recommendation system based on face attribute analysis.
  • Mo Zhou, B.S. & M.S. 2013 - 2020. (Co-supervise with Prof. Zhenxing Niu and Prof. Gang Hua)
    • Ph.D. candidate, Johns Hopkins University.
    • Publications: T-PAMI submitted, ICCV'2021, ECCV'2020, AAAI'2020, ICCV'2017, CVPR'2016. 
    • Patents: one patent issued. 
  • Junwen Tian, M.S. 2018 - 2021. 
    • Engineer, China Construction Bank, Chengdu, China.
    • Publications: PR'2023.
    • Patents: one patent issued.
  • Qing Li, M.S. 2018 - 2021. 
    • Engineer, Agricultural Bank of China, Wuhan, China. 
    • Publications: T-MM'2021.
    • Patents: one patent pending.
  • Shi Yu, M.S. 2018 - 2021. 
    • Engineer, TP-LINK, Hangzhou, China. 
    • Project: Skeleton-based human action recognition.
  • Fang Zheng, 2019 - 2022. 
    • Engineer, Huawei, Shanghai, China. 
    • Publications: ICCV'2021.
    • Patents: one patent issued. 
    • Honors: Tencent Grand Scholarship/腾讯特等奖学金.
  • Hongzhen Liu, 2019 - 2022. 
    • Engineer, ByteDance, Hangzhou, China. 
    • Publications: T-IP'2022.
    • Patents: one patent pending.

Undergraduates

  • Yuanhao Zhai, 2018.03 - 2021.07.
    • Ph.D. candidate, University at Buffalo, State University of New York.
    • Publications: T-PAMI'2022, T-MM'2021, ECCV'2020, ICIP'2019. 
    • Patents: one patent issued, one patent pending.
  • Zijian Kang, 2018.03 - 2019.07.
    • Publications: AIAI'2019. 
    • Patents: one patent issued.
  • Yuxuan Wu, 2021.07 - 2022.07.
    • Publications: AAAI'2023. 

Photos

2020.06.22

 

2018.06.07