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项目资助

Project name    第三代半导体SiC晶片智能检测技术与装置研发(2023YFE0203800)
Project origin    国家重点研发计划重点专项
Start Date    2023-07~-
Project Fund    Ten thousand yuan
Project kind    Vertical project
Project status    Processing
Project advantage    Good development prospect Product or process is innovative Remarkable economical benefit Significant social benefits
Technical excellence   
Feasibility   
Description   
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