Boundary conditions optimization of spindle thermal error analysis and thermal key points selection based on inverse heat conduction[J].
发布时间：2025-04-30
点击次数：
- 发布时间：
- 2025-04-30
- 论文名称：
- Boundary conditions optimization of spindle thermal error analysis and thermal key points selection based on inverse heat conduction[J].
- 发表刊物：
- International Journal of Advanced Manufacturing Technology
- 摘要：
- International Journal of Advanced Manufacturing Technology
- 合写作者：
- Li Yang, Zhao Wanhua, Wu Wuwen, Lu Bingheng.
- 是否译文：
- 否
- 发表时间：
- 2016-10-22