邮箱：
学位：博士学位（2016-2020）
单位：电气学院
工业自动化系
宽禁带功率半导体器件封装集成研究中心
Associate Professor， PhD Supervisor
School of Electrical Engineering
Xi'an Jiaotong University (XJTU)
IEEE Senior Member -2022
“The more I learn, the more I realize how much I don’t know.” Albert Einstein
"Fueled by curiosity and coffee, I'm on a lifelong journey of learning." A Houran
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WBG Center Intro:
The Wide Bandgap Power Semiconductor Device Packaging and Integration Research Center (WBG Center| led by Prof. Laili Wang) is affiliated with the Power Electronics and Renewable Energy Research Center (PEREC). The center primarily focuses on research areas such as wide bandgap power semiconductor device chip design, packaging integration, and high-performance applications.
Since 2023, the WBG Center has collaborated with the Shaoxing Municipal Government to establish the Xi’an Jiaotong University-Shaoxing Tongyue Wide Bandgap Semiconductor Research Institute, with an investment of hundreds of millions of yuan. This initiative aims to address critical "bottleneck" challenges currently faced by China’s wide bandgap semiconductor industry.
宽禁带功率半导体器件封装与集成研究中心（WBG中心）隶属于电力电子与可再生能源研究中心（PEREC）。该中心的主任是王来利教授。研究中心主要开展宽禁带功率半导体器件芯片设计、封装集成及高性能应用等方向的研究。自2023年起，宽禁带中心与绍兴市政府联合成立西安交通大学绍兴市通越宽禁带半导体研究院，投资数亿元致力于解决目前我国宽禁带半导体领域面临的卡脖子问题。
The Wide Bandgap Power Semiconductor Device Packaging and Integration Research Center
宽禁带功率半导体器件封装集成研究心 http://www.perec.xjtu.edu.cn/rcdw/szxq1/kjdglbdtqjfzjcyjzx.htm
Electromagnets/ Magnetic Components
招生信息
招生人数：每年招收博士研究生 2-3 名，硕士研究生3-5名 (包括留学生)
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Opportunities for International Students (CSC Scholarship / Self-funded)
We invite highly motivated international students to join our research group.
Available Positions
PhD: 2–3 positions available per year
Master’s: 2–3 positions available per year
Research Areas
Our research focuses on cutting-edge topics in Power Electronics, including but not limited to:
Wireless Power Transfer (WPT) Systems
Wide Bandgap (WBG) Semiconductor Packaging and Integration
Applications of Artificial Intelligence (AI) in Power Electronics
Power Converters (AC/DC, DC/DC) and Magnetic Components
Application Requirements
Interested candidates are requested to submit the following documents in English:
Curriculum Vitae (CV)
Academic transcripts
Relevant certificates (e.g., degree certificates, publications, or language test scores)
Important Notes
Proficiency in both spoken and written English is mandatory.
The final selection of candidates will depend on several factors, including the applicant’s academic performance and the relevance of their background to our current research directions.
