Associate Professor， PhD Supervisor 

School of Electrical Engineering

Xi'an Jiaotong University (XJTU)   

IEEE Senior Member -2022

Contact

Houran@xjtu.edu.cn

eng.horan(at)yahoo.com 

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“The more I learn, the more I realize how much I don’t know.” Albert Einstein

"Fueled by curiosity and coffee, I'm on a lifelong journey of learning." A Houran 

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WBG Center Intro: 

The Wide Bandgap Power Semiconductor Device Packaging and Integration Research Center (WBG Center| led by Prof. Laili Wang) is affiliated with the Power Electronics and Renewable Energy Research Center (PEREC). The center primarily focuses on research areas such as wide bandgap power semiconductor device chip design, packaging integration, and high-performance applications.

Since 2023, the WBG Center has collaborated with the Shaoxing Municipal Government to establish the Xi’an Jiaotong University-Shaoxing Tongyue Wide Bandgap Semiconductor Research Institute, with an investment of hundreds of millions of yuan. This initiative aims to address critical "bottleneck" challenges currently faced by China’s wide bandgap semiconductor industry.

宽禁带功率半导体器件封装与集成研究中心（WBG中心）隶属于电力电子与可再生能源研究中心（PEREC）。该中心的主任是王来利教授。研究中心主要开展宽禁带功率半导体器件芯片设计、封装集成及高性能应用等方向的研究。自2023年起，宽禁带中心与绍兴市政府联合成立西安交通大学绍兴市通越宽禁带半导体研究院，投资数亿元致力于解决目前我国宽禁带半导体领域面临的卡脖子问题。

The Wide Bandgap Power Semiconductor Device Packaging and Integration Research Center 

宽禁带功率半导体器件封装集成研究心 http://www.perec.xjtu.edu.cn/rcdw/szxq1/kjdglbdtqjfzjcyjzx.htm