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Representative Papers:
⬇⬇⬇⬇⬇***Full Publication list***⬇⬇⬇⬇⬇
Submitting Work:
2026:
2025:
李忠良, 卢 溶, 李 洋, 张秋光, 张国和, 温小梅, 屈方园. 系统级封装的瞬时剂量率效应PI-SI联合仿真. 现代应用物理, 2025, 16(3), 030603(1-10).
Li, N., Peng, Z., Mao, C., Qin, F., Li, Y., Li Y.*, ... & He, C. (2025). Experimental Study on Electromagnetic Pulse Sensitivity for Power Modules of FPGAs. Electronics, 14(6), 1167.
2024(No publications. Just find work; write and submit paper.)
2023:
2022:
2021:
2020 and before:
2025:
2024:
2021: