A high-resolution analytical thermal modeling method of capacitor bank considering thermal coupling and different cooling modes
- 发布时间:2026-07-21
- 论文名称:A high-resolution analytical thermal modeling method of capacitor bank considering thermal coupling and different cooling modes
- 发表刊物:IEEE Transactions on Power Electronics
- 合写作者:C. Lv, J. Liu, Y. Zhang, et al.
- 论文类型:期刊论文
- 是否译文:否
- 收录刊物:SCI
- 合写作者:C. Lv, J. Liu, Y. Zhang, et al.