[1] Y. Zhao, S. Li, J. Qiao, X. Liu, Z. Wang, F. Wei, B. Jiao, Deep Learning-Enhanced Hybrid Sensing: Enabling Gas Identification in Extreme Vacuum Environments, IEEE Sensors Journal 26 (2026) 6313–6320. https://doi.org/10.1109/JSEN.2025.3649843.

[2] G. Lu, Y. Ye, R. Liu, Y. Kong, Y. Zhao, S. Jia, J. Qiao, X. Meng, X. Du, Q. Wang, B. Jiao, Synergistic thermal management of heterogeneous 2.5D integration: Embedded manifold microchannel cooling for high-flux heat dissipation and thermal crosstalk suppression, Applied Thermal Engineering 300 (2026) 131418. https://doi.org/10.1016/j.applthermaleng.2026.131418.

[3] Y. Dong, R. Su, S. Jia, Y. Ye, R. Liu, W. Zhou, Q. Wang, B. Jiao, Junction temperature distributions with hot spots and uniform and non-uniform heat fluxes in direct-to-die passive two-phase immersion cooling, International Communications in Heat and Mass Transfer 176 (2026) 111301. https://doi.org/10.1016/j.icheatmasstransfer.2026.111301.

[4] Y. Dong, B. Jiao, Two-mode bubble detachment mechanisms: Enhancing critical heat flux and the heat transfer coefficient in shallow liquid boiling, International Journal of Thermal Sciences 220 (2026) 110419. https://doi.org/10.1016/j.ijthermalsci.2025.110419.

[5] X. Zhou, Y. Ye, Y. Kong, R. Liu, B. Jiao, Z. Yuan, S. Wang, Z. Jiang, Z. Qu, Embedded Microfluidic cooling for System on wafer: thermal design and CFD simulation, in: 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025: pp. 1–6. https://doi.org/10.1109/ICEPT67137.2025.11157230.

[6] Z. Yuan, Y. Ye, Y. Kong, R. Liu, B. Jiao, S. Jia, G. Lu, X. Zhou, S. Wang, The study of embedded microfluidic cooling for chip thermal management at KW/cm2 level, in: 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025: pp. 1–4. https://doi.org/10.1109/ICEPT67137.2025.11156960.

[7] L. Yu, Y. Ye, X. Du, Y. Kong, R. Liu, Y. Dong, S. Yun, J. Qiao, D. Lu, Z. Liu, B. Jiao, An adaptive cooling method with smart flow regulation capacity based on shape memory alloy for multiple chips electronic system, Thermal Science and Engineering Progress 59 (2025) 103329. https://doi.org/10.1016/j.tsep.2025.103329.

[8] Y. Ye, G. Lu, P. Li, Y. Kong, R. Liu, X. Meng, J. Qiao, J. Shen, B. Jiao, Silicon-based package level liquid cooling module for system on wafer (SoW), in: 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025: pp. 1–5. https://doi.org/10.1109/ICEPT67137.2025.11157530.

[9] R. Su, Y. Dong, Y. Kong, B. Jiao, X. Du, E. Rui, Y. Xiong, R. Liu, Y. Ye, J. Qiao, Experimental study on a novel Si-Cu-based vapor chamber for chip heat dissipation, Thermal Science and Engineering Progress 67 (2025) 104088. https://doi.org/10.1016/j.tsep.2025.104088.

[10] J. Qiao, Ruiwenliu, Y. Kong, B. Jiao, Z. Hou, F. Han, S. Yun, Y. Ye, X. Du, Z. Wang, S. Li, Three-In-One Chip Designed for Wide Range Vacuum Sensing, in: 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2025: pp. 288–291. https://doi.org/10.1109/NEMS67320.2025.11169794.

[11] J. Qiao, Y. Kong, Ruiwenliu, B. Jiao, S. Yun, Y. Ye, X. Du, Z. Wang, S. Li, G. Lu, X. Meng, RuihaiSu, Design and Fabrication of a High-Sensitivity Mems Pirani Vacuum Sensor with Three-Mode Switching, in: 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2025: pp. 214–217. https://doi.org/10.1109/NEMS67320.2025.11169964.

[12] K. Li, Z. Yuan, C. Zhao, Y. Kong, R. Liu, B. Jiao, W. Gao, A Low-Thermal-Resistance Packaging Technology in multi-chip Microsystem, in: 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025: pp. 1–7. https://doi.org/10.1109/ICEPT67137.2025.11157506.

[13] Y. Lei, X. Du, Y. Wei, H. Zhu, Y. Kong, H. Zhao, B. Jiao, X. Liu, X. Qian, R. Yang, Hotspot thermal management using thermoelectric and microchannel hybrid cooling at transient and steady states, Applied Thermal Engineering 265 (2025) 125556. https://doi.org/10.1016/j.applthermaleng.2025.125556.

[14] L. Ju, P. Jiang, X. Zhou, R. Liu, Y. Kong, Y. Ye, B. Jiao, H. Sun, F. Wei, Design and Implementation of Multi-Channel Temperature Measurement System of Thermal Test Chip Based on Diode Temperature-Sensitive Arrays, Thermo 5 (2025) 6. https://doi.org/10.3390/thermo5010006.

[15] L. Ju, P. Jiang, Y. Ren, R. Liu, Y. Kong, S. Yun, Y. Ye, B. Jiao, Q. Hao, H. Sun, Overview of Research Progress and Application Prospects of Thermal Test Chips, Micromachines 16 (2025) 669. https://doi.org/10.3390/mi16060669.

[16] X. Du, Y. Ye, B. Jiao, Y. Kong, L. Yu, R. Liu, S. Yun, D. Lu, J. Qiao, Z. Liu, R. Yang, A flexible thermal management method for high-power chips in humanoid robots, Device 3 (2025) 100576. https://doi.org/10.1016/j.device.2024.100576.

[17] X. Du, Y. Kong, Y. Ye, H. Zhu, R. Liu, G. Zhang, S. Yun, B. Jiao, Dual-embedded cooling for thermoelectric coolers in electronics thermal management, Applied Thermal Engineering 281 (2025) 128568. https://doi.org/10.1016/j.applthermaleng.2025.128568.

[18] Y. Dong, A. Ibrahim, R. Su, B. Jiao, X. Hu, Pool boiling enhancement through cylindrical confined space over open rectangular microchannels, International Communications in Heat and Mass Transfer 162 (2025) 108576. https://doi.org/10.1016/j.icheatmasstransfer.2025.108576.

[19] L. Yu, Y. Ye, Z. Wang, R. Liu, X. Du, Y. Kong, S. Yun, J. Wang, Y. Shi, B. Jiao, Investigation on the unconstrained microfluidic heat sink with high anti-blockage capacity for multiple hotspots system, Therm Sci 28 (2024) 877–888. https://doi.org/10.2298/TSCI230214174Y.

[20] L. Yu, B. Jiao, Y. Ye, X. Du, Y. Kong, R. Liu, J. Qiao, S. Yun, Z. Wang, W. Li, Y. Yan, D. Lu, Z. Liu, R. Yang, An adaptive thermal management method via bionic sweat pores on electronic devices, Applied Thermal Engineering 247 (2024) 122953. https://doi.org/10.1016/j.applthermaleng.2024.122953.

[21] Y. Ye, X. Du, C. Gao, Y. Kong, G. Lu, X. Meng, B. Jiao, Evaluation of Mobile Data Center Cooling Performance Based on Embedded Cooling, in: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 2024: pp. 1–4. https://doi.org/10.1109/ESTC60143.2024.10712094.

[22] G. Lu, Y. Ye, C. Li, B. Jiao, Y. Kong, R. Liu, Three-Dimensional Manifold Microchannel Integrated Heat Sink for High-Performance Computing Chips, in: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), 2024: pp. 1221–1224. https://doi.org/10.1109/EPTC62800.2024.10909917.

[23] D. Lu, Y. Ye, R. Liu, M. Wu, X. Du, L. Yu, J. Qiao, Z. Liu, Y. Kong, B. Jiao, X. Ma, Y. Hao, Near-Junction Thermal Management of GaN-on-SiC MMIC Power Amplifier Through Substrate Embedded Microchannel, IEEE Transactions on Electron Devices 71 (2024) 502–509. https://doi.org/10.1109/TED.2023.3338586.

[24] N. Kuang, G. Lu, K. Li, Y. Kong, J. Zheng, B. Jiao, The study of heat characteristics for micro pin-fin heat sinks with different structures, Therm Sci 28 (2024) 889–901. https://doi.org/10.2298/TSCI230311175K.

[25] W. Gao, Z.G. Qu, J.F. Zhang, B. Jiao, Experimental study of flow boiling in microchannel heat sink enhanced with partially in-line pin fins fence arrangement, International Communications in Heat and Mass Transfer 159 (2024) 108179. https://doi.org/10.1016/j.icheatmasstransfer.2024.108179.

[26] Y. Dong, A. Ibrahim, R. Su, B. Jiao, X. Hu, Y. Hao, Study on bubble behaviors and heat transfer at shallow liquid boiling over open rectangular microchannels, Applied Thermal Engineering 254 (2024) 123900. https://doi.org/10.1016/j.applthermaleng.2024.123900.

[27] Y. Ye, X. Du, Y. Kong, R. Liu, S. Yun, S. Jia, W. Li, X. Lv, P. Lin, Z. Wang, B. Jiao, Experimental Investigations on Thermal Superposition Effect by Embedded Manifold Cooling, in: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023: pp. 1017–1021. https://doi.org/10.1109/EPTC59621.2023.10457888.

[28] B. Cong, R. Liu, Y. Ye, X. Du, L. Yu, N. Zhang, S. Jia, Y. Kong, B. Jiao, Investigation on the heat dissipation of high heat flux chip array by fractal microchannel networks, Therm Sci 27 (2023) 869–880. https://doi.org/10.2298/TSCI220315079C.

[29] N. Zhang, Y. Ye, Q. Liu, J. Shen, B. Jiao, Y. Kong, R. Liu, B. Cong, L. Yu, X. Du, K. Jia, S. Jia, Embedded Microchannel Cooler with Manifold for IC Chips, in: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), 2022: pp. 923–926. https://doi.org/10.1109/MEMS51670.2022.9699560.

[30] N. Zhang, R. Liu, Y. Kong, Y. Ye, X. Du, B. Cong, L. Yu, Z. Wang, Y. Dai, W. Li, B. Jiao, Z. Duan, Experimental investigation of the embedded micro-channel manifold cooling for power chips, Therm Sci 26 (2022) 1531–1543. https://doi.org/10.2298/TSCI210908328Z.

[31] N. Zhang, B. Jiao, Y. Ye, Y. Kong, X. Du, R. Liu, B. Cong, L. Yu, S. Jia, K. Jia, Embedded cooling method with configurability and replaceability for multi-chip electronic devices, Energy Conversion and Management 253 (2022) 115124. https://doi.org/10.1016/j.enconman.2021.115124.

[32] Y. Ye, M. Wu, Y. Kong, R. Liu, L. Yang, X. Zheng, B. Jiao, X. Ma, W. Bao, Y. Hao, Active Thermal Management of GaN-on-SiC HEMT With Embedded Microfluidic Cooling, IEEE Transactions on Electron Devices 69 (2022) 5470–5475. https://doi.org/10.1109/TED.2022.3195482.

[33] Y. Ye, J. Wang, L. Yu, Y. Kong, R. Liu, X. Du, S. Yun, Y. Shi, B. Jiao, Embedded manifold cooling system for high performance computing ICs, in: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), IEEE, Dalian, China, 2022: pp. 1–5. https://doi.org/10.1109/ICEPT56209.2022.9873186.

[34] Y. Ye, B. Jiao, Y. Kong, R. Liu, X. Du, K. Jia, S. Yun, D. Chen, Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling, Applied Thermal Engineering 202 (2022) 117849. https://doi.org/10.1016/j.applthermaleng.2021.117849.

[35] Q. Xing, J. Lai, Y. Ye, B. Jiao, G. Zhang, An Improved Physical Model Considering Mirco-Nano Scale Effects for Numerical Simulation of Pirani Vacuum Gauges, IEEE Electron Device Lett. 43 (2022) 1985–1988. https://doi.org/10.1109/LED.2022.3208840.

[36] S. Jia, Z. Jiang, B. Jiao, X. Liu, Y. Pan, Z. Song, J. Qu, The Microfabricated Alkali Vapor Cell with High Hermeticity for Chip-Scale Atomic Clock, Applied Sciences 12 (2022) 436. https://doi.org/10.3390/app12010436.

[37] Y. Ye, N. Zhang, L. Yu, B. Cong, R. Liu, Y. Kong, B. Jiao, Integrated Electrical Test Vehicle Co-designed with Microfluidics for Evaluating the Performance of Embedded Cooling, in: 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2021: pp. 21–25. https://doi.org/10.1109/NEMS51815.2021.9451337.

[38] Y. Ye, R. Liu, X. Du, N. Zhang, Y. Kong, B. Jiao, D. Chen, Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation, Applied Thermal Engineering 195 (2021) 117149. https://doi.org/10.1016/j.applthermaleng.2021.117149.

[39] J. Wu, Y. Kong, S. Zhu, Y. Xu, J. Miao, R. Liu, S. Yun, Y. Ye, B. Jiao, Design and Test of a Low Junction-to-Case Thermal Resistance Packaging Method, IEEE Transactions on Components, Packaging and Manufacturing Technology 11 (2021) 2130–2139. https://doi.org/10.1109/TCPMT.2021.3127954.

[40] J. Lai, Y. Kong, B. Jiao, Y. Ye, S. Yun, R. Liu, M. Ye, G. Zhang, Study on Fusion Mechanisms for Sensitivity Improvement and Measurable Pressure Limit Extension of Pirani Vacuum Gauges With Multi Heat Sinks, Journal of Microelectromechanical Systems 29 (2020) 100–108. https://doi.org/10.1109/JMEMS.2019.2954155.

[41] T. Kang, Y. Ye, Y. Jia, Y. Kong, B. Jiao, Enhanced Thermal Management of GaN Power Amplifier Electronics with Micro-Pin Fin Heat Sinks, Electronics 9 (2020) 1778. https://doi.org/10.3390/electronics9111778.

[42] L.-M. Zhang, B.-B. Jiao, S.-C. Yun, Y.-M. Kong, D.-P. Chen, Investigation and Optimization of Pirani Vacuum Gauges With Monocrystal Silicon Heaters and Heat Sinks, J. Microelectromech. Syst. 26 (2017) 601–608. https://doi.org/10.1109/JMEMS.2017.2680738.

[43] L.-M. Zhang, B.-B. Jiao, S.-C. Yun, Y.-M. Kong, C.-W. Ku, D.-P. Chen, A CMOS Compatible MEMS Pirani Vacuum Gauge with Monocrystal Silicon Heaters and Heat Sinks, Chinese Phys. Lett. 34 (2017) 025101. https://doi.org/10.1088/0256-307X/34/2/025101.

[44] L. Zhang, B. Jiao, W. Ku, L.-T. Tseng, Y. Kong, Y.-H. Chien, S. Yun, D. Chen, An electrical test method for quality detecting of wafer level eutectic bonding, J. Micromech. Microeng. 27 (2016) 015028. https://doi.org/10.1088/1361-6439/27/1/015028.