1. Xiangbin Du, Yuxin Ye, Binbin Jiao*, Yanmei Kong, Lihang Yu , Ruiwen Liu, Shichang Yun, Dichen Lu, Jingping Qiao, Ziyu Liu, Ronggui Yang*."A flexible thermal management method for high-power chips in humanoid robots".Device,Volume 3, Issue 2 (2025)
2. Xinhao Meng, Binbin Jiao*, Yuxin Ye, Yanmei Kong, Ruiwen Liu, Lihang Yu, Jingping Qiao, Dichen Lu, Ziyu LiuA novel steady-state method for measuring thermal conductivity of thermal interface materials with miniaturized thermal test chips.Measurement,Volume 242, Part C(2025)
3. Qiao, Jingping, Binbin Jiao*, Sibo Li, et al. “Highly Accurate Wide-Range MEMS Hybrid Vacuum Sensor with Highly Accurate Gas Identification.” 2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), 2025, 2075–78.
4.Xiangbin Du, Yanmei Kong, Yuxin  Ye, Hangtian Zhu, Ruiwen Liu, Guohe Zhang, Shichang Yun,Binbin Jiao*.“Dual-Embedded Cooling for Thermoelectric Coolers in Electronics Thermal Management.” APPLIED THERMAL ENGINEERING 281, no. 1 (2025). 
5.Ruihai Su, Yifang Dong, Yanmei Kong,Binbin Jiao*,et al. “Experimental Study on a Novel Si-Cu-Based Vapor Chamber for Chip Heat Dissipation.” THERMAL SCIENCE AND ENGINEERING PROGRESS ( 2025). 
6.Binbin Jiao*, Jingping Qiao, Shiqi Jia, Ruiwen Liu, Xueyong Wei*, Shichang Yun, Yanmei Kong, Yuxin Ye, Xiangbin Du, Lihang Yu, Bo Cong, "Low Stress TSV Arrays for High-Density Interconnection",Engineering,Volume 38(2024)
7.    Dichen Lu, Yuxin Ye, Ruiwen Liu, Mei Wu, Xiangbin Du, Lihang Yu，Ziyu Liu, Yanmei Kong, Binbin Jiao*, Xiaohua Ma, Yue Hao,  "Near-Junction Thermal Management of GaN-on-SiC MMIC Power Amplifier Through Substrate Embedded Microchannel" IEEE Transactions on Electron Devices Volume 71, Issue 1(2024)
8.Bo Cong, Yanmei Kong, Yuxin Ye, Ruiwen Liu, Xiangbin Du, Lihang Yu, Shiqi Jia, Zhiguo Qu, Binbin Jiao*,. A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control. APPLIED THERMAL ENGINEERING. (2023)
9.Nan Zhang, Binbin Jiao*,, Yuxin Ye, Yanmei Kong, Xiangbin Du, Ruiwen Liu, Bo Cong, Lihang Yu, Shiqi Jia, Kunpeng Jia. Embedded cooling method with configurability and replaceability for multi-chip electronic devices. ENERGY CONVERSION AND MANAGEMENT. (2022)
10.Ye, Yuxin, Binbin Jiao*, Kong, Yanmei, Liu, Ruiwen, Du, Xiangbin, Jia, Kunpeng, Yun, Shichang, Chen, Dapeng. Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling. APPLIED THERMAL ENGINEERING. (2022)
11.Lina Ju, Peng Jiang, Yu Ren, Ruiwen Liu, Yanmei Kong, Shichang Yun, Yuxin Ye, Binbin Jiao* et al. “Overview of Research Progress and Application Prospects of Thermal Test Chips.” MICROMACHINES 16, no. 6 (2025).
12.    Jinchuan Chen1,Xiao Wen1, Qinwen Huang1,Chaohui Liang1*,Wanchun Ren2*,Ruiwen Liu and ChunHua He “Sand and Dust Pollution Effects on MEMS Thermistors: A Heat Transfer Simulation” Jinchuan Chen et al 2025 J. Phys.: Conf. Ser. 2982 012013.
13.    Lina Ju , Peng Jiang , Xing Zhou  , Ruiwen Liu , Yanmei Kong , Yuxin Ye , Binbin Jiao *, Honglin Sun *and Fan Wei. “Design and Implementation of Multi-Channel Temperature Measurement System of Thermal Test Chip Based on Diode Temperature-Sensitive Arrays.”Thermo2025,5, 6.
14.    Xiao Wen，Jinchuan Chen，Qinwen Huang1*，Huihui Guo2*，Ruiwen Liu and ChunHua He.“Study of the Effect of Thermal Stress on the Performance of MEMS Pirani Gauges” Journal of Physics: Conference Series 2982 (2025) 012011. 
15.    Meng, Xinhao, Yuxin Ye,Binbin Jiao*, Yanmei Kong, and Ruiwen Liu. “A Novel Method for TIM Thermal Characteristics Measurement in Package Based on Thermal Test Chips.” 2025 8th International Conference on Electronics Technology (ICET), 2025, 801–5. 
16.    Qiao, Jingping, Ruiwenliu, Yanmei Kong, Binbin Jiao*, et al. “Three-In-One Chip Designed for Wide Range Vacuum Sensing.” 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2025, 288–91. 
17.    Qiao, Jingping, Yanmei Kong, Ruiwenliu, Binbin Jiao*, et al. “Design and Fabrication of a High-Sensitivity Mems Pirani Vacuum Sensor with Three-Mode Switching.” 2025 IEEE 20th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2025, 214–17. 
18.    Jingping Qiao, Binbin Jiao*, Ruiwen Liu, Yanmei Kong, Shichang Yun, and Yuxin Ye. “MEMS Thermal Flow Sensor with Enhanced Sensitivity by Multi Channel Data Acquisition.” 2025 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, DTIP, Design Test Integration and Packaging of MEMS/MOEMS, Institute of Electrical and Electronics Engineers Inc, 2025. 
19.    Yifang Dong, Adnan Ibrahim, Ruihai Su, Binbin Jiao*, and Xuegong Hu. “Pool Boiling Enhancement through Cylindrical Confined Space over Open Rectangular Microchannels.” INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER 162 (March 2025). 
20.    Yifang Dong, Binbin Jiao*. “Two-mode bubble detachment mechanisms: Enhancing critical heat flux and the heat transfer coefficient in shallow liquid boiling.” International Journal of Thermal Sciences 
21.    Yuan, Zihang, Yuxin Ye, Yanmei Kong,……，Binbin Jiao* . “The Study of Embedded Microfluidic Cooling for Chip Thermal Management at KW/Cm2 Level.” 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025, 1–4. 
22.    Zhou, Xing, Yuxin Ye, Yanmei Kong,……，Binbin Jiao* . “Embedded Microfluidic Cooling for System on Wafer: Thermal Design and CFD Simulation.” 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025, 1–6. 
23.    Li, Kui, Zihang Yuan, Chao Zhao， Yanmei Kong， Ruiwen Liu, Binbin Jiao*. “A Low-Thermal-Resistance Packaging Technology in Multi-Chip Microsystem.” 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025, 1–7. 
24    Ye, Yuxin, Guoran Lu, Peijie Li,……，Binbin Jiao* . “Silicon-Based Package Level Liquid Cooling Module for System on Wafer (SoW).” 2025 26th International Conference on Electronic Packaging Technology (ICEPT), 2025, 1–5. 
25.    Lihang Yu, Yuxin Ye, Xiangbin Du, Yanmei Kong, Ruiwen Liu, Yifang Dong, Shichang Yun, Jingping Qiao, Dichen Lu, Ziyu Liu,Binbin Jiao*. “An Adaptive Cooling Method with Smart Flow Regulation Capacity Based on Shape Memory Alloy for Multiple Chips Electronic System.” THERMAL SCIENCE AND ENGINEERING PROGRESS 59 (March 2025).
26.    Lu, Yizhou, Yuxin Ye, Xiaojiang Yao,Binbin Jiao*, and Guoliang Zhu. “Research on Thermal Management of 3D Embedded Microchannel Modules Applied to T/R Module.” 2025 8th International Conference on Electronics Technology (ICET), 2025, 1–5.
27.    Lei, Yifan, Xiangbin Du, Yuqing Wei, Hangtian Zhu, Yanmei Kong, Huaizhou Zhao, Binbin Jiao, Xiuliang Liu, Xin Qian, Ronggui Yang. “Hotspot Thermal Management Using Thermoelectric and Microchannel Hybrid Cooling at Transient and Steady States.” APPLIED THERMAL ENGINEERING 265 (April 2025). https://doi.org/10.1016/j.applthermaleng.2025.125556
https://doi.org/10.1016/j.tsep.2025.104088.
28.    Zhao, Rikang, Dichen Lu, Xuanwu Kang, Weike Wang,Lihua Wang, Shuangli Wu, Xingguang Tan, Yuxin Ye，Yanmei Kong，Binbin Jiao. “Limiter Performance Improvement Through Thermal Management of GaN SBD Combined Microjet Cooling With Optimized Substrate.” IEEE TRANSACTIONS ON ELECTRON DEVICES 72, no. 4 (2025): 1912–18.